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TaPoly s-BPDA

Polymide Materials (Polymide; PI)

Content


TaPoly s-BPDA

  1. Chemical Name:3,3',4,4'-Biphenyltetracarboxylic dianhydride or 4,4'-Biphthalic dianhydride
  2. CAS Number: 2420-87-3
  3. Chemical Structure:
  4. Specifications:
    Item Value
    Apperance Whit or Off White powder
    HPLC Purity ≥99.5%
    Metling Point, Celsius >298
    Moisture Content, PPM <300
    Single Metal Ion Content, PPM <1
  5. Main Applications:
    1. Polymide Film and Vanish 

 

  • PI filme and varnish are the essential  base mateials for IT modules and componets including FPCBs, Graphite sheet, and batteries, all of which are widely used in smartphone, and tablets. 
  • Adoption of FPCB made from PI film in EV bateries, semiconductors, displays and sdensors is rapidly growing. PI varnish is also bening applied for electrical insulation of the wire in EV electric motors.
  • PI film and varnish are used for manufacturing FCCL(Flexible Copper Clad Laminate).
  • PI film and varnish can be used as OLED seprator(PSPI), flexible OLED substrates and CoF (Chip on Film) of display.
  • Photosenstive PI for OLED is used as a pixel separation layer also used to replace trading glass in flexible OLED.